RIS CUTTING EDGE FOURM

Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM)

层叠超表面与柔性超表面

Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM)

Intelligent metasurface technology offers a promising path toward building cost-effective, extremely large-scale antenna arrays and on-demand manipulation of wireless environments. Building on this foundation, two emerging metasurface technologies – Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM) – have achieved significant breakthroughs in functional expansion and deployment versatility. SIM takes an innovative approach by creating a neural network-like structure from multiple layers of programmable metasurfaces. This electromagnetic computing framework can handle signal processing tasks directly in the wave domain, thereby achieving the intelligent utilization of the electromagnetic space. FIM has significantly expanded the deployment and application scope of conventional rigid metasurfaces, enabling them to flexibly adapt to any surface shape. It is particularly worth noting that with the introduction of the electromagnetic drive Lorentz force mechanism, FIM with real-time shape control capabilities can significantly enhance the overall performance of wireless communication and sensing systems. In this talk, we will first elaborate on the basic working principles and key implementation technologies of SIM and FIM. We will then conduct an in-depth analysis of specific application cases of these two technologies in communication and sensing application scenarios, before addressing the primary research challenges and opportunities that need to be tackled for successful deployment of these systems in practice.

Jiancheng An received the B.S. degree in Electronics and Information Engineering and the Ph.D. degree in Information and Communication Engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2016 and 2021, respectively. From 2019 to 2020, he was a Visiting Scholar with the Next-Generation Wireless Group, University of Southampton, U.K. From 2022 to 2023, he was with the Engineering Product Development (EPD) Pillar, Singapore University of Technology and Design (SUTD). He is currently a Research Fellow with the School of Electrical and Electronics Engineering, Nanyang Technological University (NTU), Singapore. Since 2022, he has been working on advanced intelligent metasurface technologies, including Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM). He has published more than 90 academic papers in IEEE WCM, JSAC, TWC, TAP, TSP and other top journals and academic conferences, including 4 ESI highly cited papers. He received the Best Paper Award at the 2023 IEEE International Conference on Communications. Currently, he serves as an Associate Editor of IEEE Wireless Communications Letters and a Guest Editor of IEEE Wireless Communications.